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IEEE P2020 Automotive Imaging
standard by IEEE, 08/17/2018

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– Active.The IEEE‐SA P2020 working group on automotive imaging standards was established in order to address the considerable ambiguity in measurement of image quality of automotive imaging systems, both human and computer vision based. This white paper outlines the goals, achievements, rationale and plans of the subgroup, which has started to work on development of a new standard.Image quality plays a crucial role for both automotive viewing and automotive computer vision applications and today s image evaluation approaches do not necessarily meet the needs of such applications. Currently there is not a consistent approach within the industry to measure automotive image quality. The IEEE P2020 working group is attempting to remedy these deficiencies by connecting people in the field, identifying gaps in existing standards, and working to address these by creating a coherent set of key performance indicators by which camera systems and components may be evaluated in a manner consistent with their intended use. This white paper provides an overview of current activities including initial gap analysis and details of what may be expected from the full standard when published.

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Published:
08/17/2018
ISBN(s):
9781504451130
Number of Pages:
32
File Size:
1 file , 7.4 MB
Product Code(s):
STDVA23262

IEEE White Paper

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IEEE Industry Connections (IEEE-IC) 3D Body Processing (3DBP) Initiative – An Introduction
standard by IEEE, 02/15/2017

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– Active.The background, goals, and status for the IEEE 3D body processing (3DBP) initiative are introduced in this white paper. This initiative was launched in the first quarter of 2016 with an initial focus on exploring technology standardization opportunities for hardware and software technologies across the 3D body processing pipeline; i.e., from scanning of people and creating body model data to simulating, modeling, analytics, and visualization. A Virtual Fit use case and relevant 3DBP attributes are examined as an example of a 3D body processing use case. File formats, metadata, and communication protocols are discussed and initial guidance is proposed for evaluating and selecting among existing formats and protocols. While the white paper utilizes examples from an apparel/retail context, it is important to note that the direction taken by the 3DBP initiative is applicable to use cases in other industries such as health, wellness, fitness and athletics as well as complementary to adjacent technology ecosystems such as IOT, 5G, AI, fog, and cloud computing.

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Published:
02/15/2017
ISBN(s):
9781504437806
Number of Pages:
22
File Size:
1 file , 2.8 MB
Product Code(s):
STDVA22442

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Proposed IEEE Certification for Nuclear Qualified Electrical Equipment
standard by IEEE, 10/15/2015

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– Active.The IEEE Standards Association (IEEE-SA) and the IEEE Nuclear Power Engineering Committee (NPEC) formed the NPEC Conformity Assessment Steering Committee (NPEC CASC) in September 2014. The NPEC CASC boasts an outstanding constituency of members in the domain of nuclear power technology who share a common vision to accelerate IEEE standards adoption through conformity assessment and certification programs. Participants in NPEC CASC include representatives from device manufacturers, test laboratories and the end-user community. IEEE-SA Conformity Assessment Program (ICAP) creates and implements initiatives that drive and accelerate certification programs throughout industry addressing a broad range of technologies. ICAP, along with the NPEC CASC, is looking into development of a conformity assessment program to support IEEE Std 323(TM) and other related standards. This paper will provide readers with an in-depth look at the current state of equipment qualification in the nuclear industry globally. It will also present the benefits of a comprehensive certification program. It will provide a varied perspectives ranging from a utility, plant owner, and manufacturer to regulators. The following are considered key activities of the NPEC CASC: — Recommend and consolidate program structure for the certification of Class 1E devices — Recommend and establish compliance levels — Provide guidance on test methods — Recommend and establish test lab requirements and audit processes — Recommend and establish test tool validation — Act as certification program advocates — Validate Test Plan/Report template

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Published:
10/15/2015
ISBN(s):
9781504400473
Number of Pages:
11
File Size:
1 file , 540 KB
Product Code(s):
STDVA20474

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IEEE 3D Body Processing – Industry Connections (3DBP IC): Communication, Security, and Privacy
standard by IEEE, 12/09/2019

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– Active.The 3DBP IC Communications, Security and Privacy (CSP) subgroup is investigating the protection of data and records that may contain personal information, and how to ensure users and consumers expectations relative to privacy and security. The subgroup has determined that the requirements from the IEEE draft standards of P7002, P7004, and P7012 can be applied to 3DBP to help ensure security and privacy. Furthermore, it appears existing standards and industry practices will be helpful to enable the CSP to create requirements as normative clauses in a standard, and will use the existing standards, to the extent possible, to help enable safe, secure, transparent, and private processing of 3DBP information. In addition, the global impact of the EU GDPR will have a rippling influence on privacy requirements and the CSP is further assessing GDPR relative to data and record exchange in terms of privacy and security.

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Published:
12/09/2019
ISBN(s):
9781504461788
Number of Pages:
15
File Size:
1 file , 560 KB
Product Code(s):
STDVA23901

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IEEE-SA Industry Connections and AMTSO Mobile Adware Guidelines – Version 1.0 (IEEE/AMTSO White Paper)
standard by IEEE, 11/03/2015

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Published:
11/03/2015
ISBN(s):
9781504400688
Number of Pages:
8
File Size:
1 file , 1.4 MB
Product Code(s):
STDVA20493

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Cloud Computing Innovation in India: A Framework and Roadmap – White Paper 2.0
standard by IEEE, 12/31/2014

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– Active.This paper represents the consolidated work of a significant body of experts from industry, government, academia, and professional bodies that came together within the CCICI to assess global trends in Cloud Computing, the status of India, India-specific challenges and opportunities, and recommendations to accelerate Cloud Computing adoption and innovation in India. This paper presents a roadmap for Cloud Computing in India spanning the following three phases: 1.) Foundation and adoption; 2.) Penetration and scale out; 3.) Maturity and global leadership. The next five years are expected to be an exponential growth phase for Cloud Computing in India. Rapid adoption of cloud in the global market and the prolific innovation for the cloud and on the cloud represents a disruptive play in the IT/ITES industry. This is a great opportunity as well as threat for Indias IT/ITES industry. A proper strategy and focus on innovation is essential to be able to ride this wave as opposed to being washed away by it.

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Published:
12/31/2014
ISBN(s):
9780738191881
Number of Pages:
206
File Size:
1 file , 8 MB
Product Code(s):
STDVA98702

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IEEE 802 Nendica Report: The Lossless Network for Data Centers
standard by IEEE, 08/17/2018

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– Active.Modern data centers are tasked with delivering intelligent multi-media responses to real-time human interactions. Massive amounts of data are being churned and sifted by highly parallel applications, such as Online Data Intensive Services (OLDI) and Artificial Intelligence (AI), which historically required specialized High-Performance Computing (HPC) infrastructure. New advancements in high-speed distributed solid-state storage, coupled with remote direct memory access (RDMA) and new networking technologies to better manage congestion, are allowing these parallel environments to run atop more generalized next generation cloud infrastructure. Generalized cloud infrastructure is also being deployed in the telecommunication operatoraEUR(TM)s central office. The key to advancing cloud infrastructure to the next level is the elimination of loss in the network, not just packet loss, but throughput loss and latency loss. There simply should be no loss in the data center network. Congestion is the primary source of loss and in the network, congestion leads to dramatic performance degradation. This paper discusses the need for new technologies to combat loss in the data center network and introduces promising potential solutions.

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Published:
08/17/2018
ISBN(s):
9781504451024
Number of Pages:
29
File Size:
1 file , 6.8 MB
Product Code(s):
STDVA23253

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Assessment of DER Interconnection Installation for Conformance with IEEE Std 1547
standard by IEEE, 02/22/2018

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Standards and codes establish the functional performance requirements of equipment interconnecting Distributed Energy Resources (DERs) with an Electric Power System (EPS). Nationally Recognized Testing Laboratories (NRTLs) evaluate equipment for safety and compliance with applicable standards and codes. Equipment meeting these requirements are then listed as suitable for their intended use in compliance with the applicable requirements. The EPS operator enters into a binding agreement with the DER operator for interconnection with the EPS at a specific site to meet the requirements of the EPS infrastructure at that location. IEEE Conformity Assessment Program proposes a process and procedure to ensure compliance with the applicable standards and the interconnection agreement.

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Published:
02/22/2018
ISBN(s):
9781504447102
Number of Pages:
18
File Size:
1 file , 5.2 MB
Product Code(s):
STDVA23015

IEEE White Paper

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IEEE-SA Conformity Assessment Program for IEEE 1588(TM) in Mobile Networks
standard by IEEE, 11/28/2014

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– Active.Over the past few years, the IEEE 1588(TM) Precision Time Protocol (PTP) standard has been adopted by the telecommunications industry as a preferred solution for synchronizing mobile networks. A key challenge is ensuring that PTP equipment from different manufacturers will operate properly in a mobile network. This paper presents the scope and objectives of the IEEE 1588 Telecommunications Certification Program, launched by the IEEE-SA Conformity Assessment Program (ICAP) to meet this challenge.

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Published:
11/28/2014
ISBN(s):
9780738194028
Number of Pages:
14
File Size:
1 file , 1.5 MB
Product Code(s):
STDVA20020

IEEE White Paper

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IEEE Industry Connections (IEEE-IC) Landmarks and Measurement Standards Comparison in 3D Body-model Processing
standard by IEEE, 02/22/2018

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– Active.This white paper reviews the current standards landscape for three-dimensional body scanning, body landmarking, and measuring. International standards are compared and recommendations are made for a minimal set of landmarks and measurements (L&M) needed for several industrial use cases of 3D Body Processing such as fit and size estimation, retail, clothing manufacturing, CAD tool developers, and body model storage and service.

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Published:
02/22/2018
ISBN(s):
9781504446556
Number of Pages:
34
File Size:
1 file , 5.2 MB
Product Code(s):
STDVA22978

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IEEE Industry Connections (IEEE-IC) Personalized Digital Last (a Women s Example)–The Tool Required to Enable Mass Customization
standard by IEEE, 04/20/2018

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– Active.This white paper examines the development of a personalized digital last and the impact on the role of footwear technicians. As the personalized digital last becomes the basis of future footwear production, the role of footwear technicians may expand to include a broader definition of fit, maintaining libraries of different lasts, and maintaining quality safeguards for mass customized of footwear. Though this paper focuses on women s footwear, the issue of fit is universal for men, women, and children. The techniques described in this paper, can be utilized for most footwear segments.

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Published:
04/20/2018
ISBN(s):
9781504448604
Number of Pages:
18
File Size:
1 file , 5.3 MB
Product Code(s):
STDVA23106